| Publication CODE |
Title |
| IEC 62047-26:2016 (2016-01) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 26: DESCRIPTION AND MEASUREMENT METHODS FOR MICRO TRENCH AND NEEDLE STRUCTURES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
57 P.. |
Description
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2016-01-07 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2016-01-07 |
| IEC stability date |
2020-12-31 |
| IEC file modification date |
2016-01-06 |
| IEC last modification date |
2017-10-11 |
|
