| Publication CODE |
Title |
| IEC 62047-25:2016 (2016-08) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
45 P.. |
Description
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2016-08-29 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2016-08-29 |
| IEC stability date |
2021-12-31 |
| IEC file modification date |
2016-08-26 |
| IEC last modification date |
2019-11-04 |
|
