| Publication CODE |
Title |
| IEC 62047-2:2006 (2006-08) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
25. |
Description
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2006-08-15 |
| ICS-Code (International Standards Classification) |
31.080.99
|
|
| IEC publication date |
2006-08-15 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2018-10-31 |
|
