| Publication CODE |
Title |
| IEC 62047-9:2011 (2011-07) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
49 P. |
Description
IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters. The contents of the corrigendum of March 2012 have been included in this copy.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2011-07-13 |
| Registration |
116376 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2011-07-13 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2018-10-31 |
|
