| Publication CODE |
Title |
| IEC 62047-16:2015 (2015-03) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
21 P.. |
Description
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 ' to 10 ' in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2015-03-05 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| IEC publication date |
2015-03-05 |
| IEC stability date |
2022-12-31 |
| IEC file modification date |
2015-03-04 |
| IEC last modification date |
2018-11-12 |
|
