| Publication CODE |
Title |
| NBN EN 62047-16:2015 (2015-07) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P.. |
Description
Specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62047-16:2015.
For the series NBN EN 50XXX, the standards are however complete.
|
DE version
|
EN version
|
FR version
|
|
| Status |
Registered trilingual Belgian standard EN or FR or DE |
| Situation |
Currently active
|
|
| Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2015-04-09 |
| NBN Approval |
2015-08-21 |
| Belgian Official Journal |
2015-09-21 |
| Registration |
158587 |
| ICS-Code (International Standards Classification) |
31.080.99
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2015-04-09 |
| Date of availability (d.a.v.) |
2015-07-10 |
| Date of announcement (d.o.a.) |
2015-10-10 |
| Date of publication (d.o.p.) |
2016-01-10 |
| Date of withdrawal former edition (d.o.w.) |
2018-04-09 |
|
