| Publication CODE |
Title |
| NBN EN IEC 60749-37:2022 (2022-11) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Committee |
CLC/SR 47
Semiconductor devices
|
| BEC Approval |
2022-11-16 |
| NBN Approval |
2022-11-23 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2022-11-16 |
| Date of announcement (d.o.a.) |
2023-02-16 |
| Date of publication (d.o.p.) |
2023-08-16 |
| Date of withdrawal former edition (d.o.w.) |
2025-11-16 |
| IEC file modification date |
2022-11-19 |
|
