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Publication details

Publication CODE Title
IEC 60749-21:2004 (2004-03) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
 
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Description
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60749-21:2011
Partly replaces  IEC 60749:1996
Partly replaces  IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
Partly replaces  IEC 60749:1996/AMD1:2000
Partly replaces  IEC 60749:1996/AMD2:2001
Replaces  IEC PAS 62173:2000
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2004-03-17
ICS-Code (International Standards Classification) 31.080.01
IEC publication date 2004-03-15
IEC last modification date 2011-04-07