Publication CODE |
Title |
IEC 60664-3:2003+AMD1:2010 CSV (2010-08) |
INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
228.00 €
|
49 P.. |
Description
IEC 60664-3:2003+A1:2010 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5. This standard describes the requirements and test procedures for two methods of protection:
- type 1 protection improves the microenvironment of the parts under the protection;
- type 2 protection is considered to be similar to solid insulation.
This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1. This standard refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation.
This consolidated version consists of the second edition (2003)
and its amendment 1 (2010). Therefore, no need to order amendment in
addition to this publication.
The contents of the corrigendum of November 2010 have been included in this copy.
|
Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Committee |
TC 109
INSULATION CO-ORDINATION FOR LOW-VOLTAGE EQUIPMENT (replace COM 28A !)
|
Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2010-08-23 |
Registration |
107185 |
ICS-Code (International Standards Classification) |
29.080.30
|
NBN Status |
New |
|
IEC publication date |
2010-08-23 |
IEC stability date |
2016-12-31 |
IEC last modification date |
2016-11-04 |
|