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Publication details

Publication CODE Title
IEC 60749-8:2002 (2002-08) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 31.
Description
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Partly replaces  IEC 60749:1996
Partly replaces  IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
Partly replaces  IEC 60749:1996/AMD1:2000
Partly replaces  IEC 60749:1996/AMD2:2001
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2002-08-30
ICS-Code (International Standards Classification) 31.080.01
IEC publication date 2002-08-30
IEC stability date 2024-12-31
IEC last modification date 2019-11-20