Publication CODE |
Title |
IEC 62047-25:2016 (2016-08) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
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Price Excl. VAT |
Total number of pages, tables and drawings |
159.00 €
|
45 P.. |
Description
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
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Status |
IEC PUBLICATION |
Situation |
Currently active
|
|
Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
|
Responsible |
Ir DELENS Marc
|
BEC Approval |
2016-08-29 |
ICS-Code (International Standards Classification) |
31.080.99
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NBN Status |
New |
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IEC publication date |
2016-08-29 |
IEC stability date |
2021-12-31 |
IEC file modification date |
2016-08-26 |
IEC last modification date |
2019-11-04 |
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