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Publication details

Publication CODE Title
IEC 60749-20:2002 (2002-09) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
 
Price Excl. VAT Total number of pages, tables and drawings
159.00 € 49.
Description
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60749-20:2008
Partly replaces  IEC 60749:1996
Partly replaces  IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
Partly replaces  IEC 60749:1996/AMD1:2000
Partly replaces  IEC 60749:1996/AMD2:2001
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2002-09-30
ICS-Code (International Standards Classification) 35.040
IEC publication date 2002-09-30
IEC last modification date 2008-12-09