| Publication CODE |
Title |
| IEC PAS 62326-14:2010 (2010-09) |
PRINTED BOARDS
PART 14: DEVICE EMBEDDED SUBSTRATE - TERMINOLOGY / RELIABILITY / DESIGN GUIDE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
366.00 €
|
62 P. |
Description
IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2010-09-29 |
| NBN Approval |
2010-09-29 |
| Registration |
925090 |
| ICS-Code (International Standards Classification) |
31.180
|
|
| IEC publication date |
2010-09-29 |
| IEC stability date |
2014-12-31 |
| IEC last modification date |
2015-01-09 |
|
