Publication CODE |
Title |
NBN EN 62137-1-4:2009 (2009-02) |
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT
PART 1-4: CYCLIC BENDING TEST |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
|
3 P. |
Description
Applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate.
This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
|
Class |
C90
(TELECOMMUNICATIONS - ELECTRONIC GENERAL)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62137-1-4:2009.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
FR version
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NL version
|
DE version
|
|
Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
|
|
Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2009-02-01 |
NBN Approval |
2009-10-30 |
Belgian Official Journal |
2009-12-09 |
Registration |
96468 |
ICS-Code (International Standards Classification) |
31.190
|
NBN Status |
New |
|
Date of ratification (d.o.r.) |
2009-02-01 |
Date of availability (d.a.v.) |
2009-02-20 |
Date of announcement (d.o.a.) |
2009-05-01 |
Date of publication (d.o.p.) |
2009-11-01 |
Date of withdrawal former edition (d.o.w.) |
2012-02-01 |
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