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Publication details

Publication CODE Title
NBN EN 62418:2010 (2010-07) SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST
 
Price Excl. VAT Total number of pages, tables and drawings
25.00 € 2 P.
Description
Describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. This standard is applicable for reliability investigation and qualification of semiconductor process.
Class  C80  (ELECTRONIC COMPONENTS GENERAL)
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally only available in English or French. Only the cover page is translated and the document itself is in English or in French.

Very important notice: 98% of the text of the NBN EN 55XXX, NBN EN 6XXXX comes from the IEC text which is NOT included. This text can be ordered here: IEC 62418:2010. For the series NBN EN 50XXX, the standards are however complete.

EN version
FR version
DE version
Status
Status Registered trilingual Belgian standard EN or FR or DE
Situation Currently active
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2010-07-01
NBN Approval 2010-08-27
Belgian Official Journal 2010-10-18
Registration 107270
ICS-Code (International Standards Classification) 31.080
NBN Status New
Date of ratification (d.o.r.) 2010-07-01
Date of availability (d.a.v.) 2010-07-09
Date of announcement (d.o.a.) 2010-10-01
Date of publication (d.o.p.) 2011-04-01
Date of withdrawal former edition (d.o.w.) 2013-07-01
Correspondences with international standards
Relation International standard Date
is identical to EN 62418:2010 2010-07-09
is identical to IEC 62418:2010/ed. 1.0 2010-04-22