| Publication CODE |
Title |
| NBN EN IEC 63251:2023 (2023-12) |
TEST METHOD FOR MECHANICAL PROPERTIES OF FLEXIBLE OPTO-ELECTRIC CIRCUIT BOARDS UNDER THERMAL STRESS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
CLC/SR 91
Electronics assembly technology
|
| BEC Approval |
2023-12-06 |
| NBN Approval |
2023-12-13 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2023-12-06 |
| Date of announcement (d.o.a.) |
2024-03-06 |
| Date of publication (d.o.p.) |
2024-09-06 |
| Date of withdrawal former edition (d.o.w.) |
2026-12-06 |
| IEC file modification date |
2023-12-09 |
|
