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Publication details

Publication CODE Title
IEC 60068-2-69:1995 (1995-12) ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNT TECHNOLOGY BY THE WETTING BALANCE METHOD
 
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159.00 € 43.
Description
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60068-2-69:2007
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 1995-12-08
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 1995-12-08
IEC last modification date 2007-05-09