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Publication details

Publication CODE Title
IEC 61760-2:2007 (2007-04) SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
 
Price Excl. VAT Total number of pages, tables and drawings
42.00 € 17.
Description
IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 61760-2:2021
Replaces  IEC 61760-2:1998
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2007-04-09
ICS-Code (International Standards Classification) 31.240
IEC publication date 2007-04-24
IEC stability date 2020-12-31
IEC last modification date 2016-12-08