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Publication details

Publication CODE Title
IEC TR 62878-2-7:2019 (2019-03) DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 2-7: GUIDELINES - ACCELERATED STRESS TESTING OF PASSIVE EMBEDDED CIRCUIT BOARDS
 
Price Excl. VAT Total number of pages, tables and drawings
85.00 € 12.
Description
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2019-03-20
ICS-Code (International Standards Classification) 31.180 , 31.190
NBN Status New
IEC publication date 2019-03-20
IEC stability date 2024-12-31
IEC file modification date 2019-03-20
IEC last modification date 2019-03-20