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Publication details

Publication CODE Title
IEC 61188-5-6:2003 (2003-01) PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 37.
Description
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Partly replaced by  IEC 61188-6-2:2021
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2003-01-23
ICS-Code (International Standards Classification) 31.190
IEC publication date 2003-01-23
IEC stability date 2020-12-31
IEC last modification date 2017-11-15