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Publication details

Publication CODE Title
IEC 61190-1-2:2007 (2007-04) ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS in ELECTRONICS ASSEMBLY
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 37 P.
Description
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 61190-1-2:2014
Replaces  IEC 61190-1-2:2002
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2007-04-01
ICS-Code (International Standards Classification) 35.040
IEC publication date 2007-04-26
IEC stability date 2013-12-31
IEC last modification date 2014-02-19