Account:  - Login  |  Webstore  |  Shopping basket cart
English  |  Français  |  Nederlands

Publication details

Publication CODE Title
IEC PAS 62084:1998 (1998-12) IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
 
Price Excl. VAT Total number of pages, tables and drawings
398.00 € 105.
Description
Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 1998-12-03
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 1998-12-03
IEC last modification date 2004-12-02