Publication CODE |
Title |
NBN EN 62047-18:2013 (2013-09) |
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES
PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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3 P. |
Description
Specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/ or nonmechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
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Class |
C96
(TELECOMMUNICATIONS - ELECTRONIC MICRO ELECTRONICS - DISCRETE SEMICONDUCTOR DEVICES)
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 62047-18:2013.
For the series NBN EN 50XXX, the standards are however complete.
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EN version
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FR version
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DE version
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Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
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|
Committee |
TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
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Responsible |
Ir DELENS Marc
|
BEC Approval |
2013-08-21 |
NBN Approval |
2013-12-19 |
Belgian Official Journal |
2014-03-14 |
Registration |
145087 |
ICS-Code (International Standards Classification) |
31.080.99
|
NBN Status |
New |
|
Date of ratification (d.o.r.) |
2013-08-21 |
Date of availability (d.a.v.) |
2013-09-27 |
Date of announcement (d.o.a.) |
2013-11-21 |
Date of publication (d.o.p.) |
2014-05-21 |
Date of withdrawal former edition (d.o.w.) |
2016-08-21 |
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