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Publication details

Publication CODE Title
IEC 61249-2-51:2023 (2023-05) MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-51: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BASE MATERIALS FOR INTEGRATED CIRCUIT CARD CARRIER TAPE, UNCLAD
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 33.
Description
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2023-05-11
ICS-Code (International Standards Classification) 31.180
NBN Status New
IEC publication date 2023-05-11
IEC stability date 2028-12-31
IEC file modification date 2023-05-11
IEC last modification date 2023-05-11