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Publication details

Publication CODE Title
IEC 62137-3:2011 (2011-11) ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
 
Price Excl. VAT Total number of pages, tables and drawings
286.00 € 90 P.
Description
IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC PAS 62137-3:2008
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2011-11-08
Registration 117086
ICS-Code (International Standards Classification) 31.190
NBN Status New
IEC publication date 2011-11-08
IEC stability date 2022-12-31
IEC last modification date 2017-11-15