| Publication CODE |
Title |
| IEC TS 62647-2:2012 (2012-11) |
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
366.00 €
|
68 P. |
Description
IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 107
PROCESS MANAGEMENT FOR AVIONICS
|
| BEC Approval |
2012-11-29 |
| Registration |
129828 |
| ICS-Code (International Standards Classification) |
03.100.50
, 31.020
, 49.060
|
| NBN Status |
New |
|
| IEC publication date |
2012-11-29 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2020-01-02 |
|
