| Publication CODE |
Title |
| IEC TS 62647-22:2013 (2013-09) |
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
366.00 €
|
70 P. |
Description
IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 107
PROCESS MANAGEMENT FOR AVIONICS
|
| BEC Approval |
2013-09-25 |
| ICS-Code (International Standards Classification) |
03.100.50
, 31.020
, 49.060
|
| NBN Status |
New |
|
| IEC publication date |
2013-09-25 |
| IEC stability date |
2020-12-31 |
| IEC file modification date |
2013-09-25 |
| IEC last modification date |
2018-12-05 |
|
