Publication CODE |
Title |
NBN EN 60068-2-83:2011 (2011-10) |
ENVIRONMENTAL TESTING
PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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3 P. |
Description
Provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
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Class |
C20
(ELECTRICAL MANUFACTURE - ELECTROTECHNICAL MATERIALS GENERAL)
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60068-2-83:2011.
For the series NBN EN 50XXX, the standards are however complete.
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EN version
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FR version
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DE version
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Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
|
|
Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
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Responsible |
De heer VAN HECKE Luk
|
BEC Approval |
2011-10-12 |
NBN Approval |
2011-12-14 |
Belgian Official Journal |
2012-01-20 |
Registration |
117449 |
ICS-Code (International Standards Classification) |
19.040
, 31.190
|
NBN Status |
New |
|
Date of ratification (d.o.r.) |
2011-10-12 |
Date of availability (d.a.v.) |
2011-10-14 |
Date of announcement (d.o.a.) |
2012-01-12 |
Date of publication (d.o.p.) |
2012-07-12 |
Date of withdrawal former edition (d.o.w.) |
2014-10-12 |
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