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Publication details

Publication CODE Title
IEC 62258-2:2011 (2011-05) SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
 
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366.00 € 141 P..
Description
IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.

This publication is to be read in conjunction with IEC 62258-1:2009.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 62258-2:2005
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2011-05-25
Registration 128183
ICS-Code (International Standards Classification) 31.080.99
NBN Status New
IEC publication date 2011-05-25
IEC stability date 2026-12-31
IEC last modification date 2019-11-20