Publication details
| Publication CODE |
Title |
| IEC 61760-4:2015+AMD1:2018 CSV (2018-03) |
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
318.00 €
|
132. |
Description
IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering. This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Status
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
Origin
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
Approval
| BEC Approval |
2018-03-13 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2018-03-13 |
| IEC stability date |
2025-12-31 |
| IEC file modification date |
2018-03-13 |
| IEC last modification date |
2019-11-20 |
|
|
