| Publication CODE |
Title |
| IEC TR 62878-2-7:2019 (2019-03) |
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 2-7: GUIDELINES - ACCELERATED STRESS TESTING OF PASSIVE EMBEDDED CIRCUIT BOARDS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
12. |
Description
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2019-03-20 |
| ICS-Code (International Standards Classification) |
31.180
, 31.190
|
| NBN Status |
New |
|
| IEC publication date |
2019-03-20 |
| IEC stability date |
2024-12-31 |
| IEC file modification date |
2019-03-20 |
| IEC last modification date |
2019-03-20 |
|
