| Publication CODE |
Title |
| IEC 61188-6-4:2019 (2019-05) |
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: LAND PATTERN DESIGN - GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SURFACE MOUNTED COMPONENTS (SMD) FROM THE VIEWPOINT OF LAND PATTERN DESIGN |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
286.00 €
|
81. |
Description
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2019-05-02 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2019-05-02 |
| IEC stability date |
2024-12-31 |
| IEC file modification date |
2019-05-02 |
| IEC last modification date |
2019-05-22 |
|
