| Publication CODE |
Title |
| IEC TR 61189-5-506:2019 (2019-06) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-506: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - AN INTERCOMPARISON EVALUATION TO IMPLEMENT THE USE OF FINE-PITCH TEST STRUCTURES FOR SURFACE INSULATION RESISTANCE (SIR) TESTING OF SOLDER FLUXES in ACCORDANCE WITH IEC 61189-5-501 |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
23. |
Description
IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2019-06-26 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2019-06-26 |
| IEC stability date |
2024-12-31 |
| IEC file modification date |
2019-06-26 |
| IEC last modification date |
2019-06-26 |
|
