| Publication CODE |
Title |
| IEC 62878-1:2019 (2019-10) |
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 1: GENERIC SPECIFICATION FOR DEVICE EMBEDDED SUBSTRATES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
19. |
Description
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2019-10-14 |
| ICS-Code (International Standards Classification) |
31.180
, 31.190
|
| NBN Status |
New |
|
| IEC publication date |
2019-10-14 |
| IEC stability date |
2025-12-31 |
| IEC file modification date |
2019-10-14 |
| IEC last modification date |
2020-03-11 |
|
