| Publication CODE |
Title |
| IEC 62878-2-602:2021 (2021-06) |
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 2-602: GUIDELINE FOR STACKED ELECTRONIC MODULE - EVALUATION METHOD OF INTER-MODULE ELECTRICAL CONNECTIVITY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
24. |
Description
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2021-06-22 |
| ICS-Code (International Standards Classification) |
31.180
, 31.190
|
| NBN Status |
New |
|
| IEC publication date |
2021-06-22 |
| IEC stability date |
2026-12-31 |
| IEC file modification date |
2021-06-22 |
| IEC last modification date |
2021-06-22 |
|
