Publication details
| Publication CODE |
Title |
| IEC 61249-2-51:2023 (2023-05) |
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-51: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BASE MATERIALS FOR INTEGRATED CIRCUIT CARD CARRIER TAPE, UNCLAD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
33. |
Description
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Status
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
Origin
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
Approval
| BEC Approval |
2023-05-11 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2023-05-11 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2023-05-11 |
| IEC last modification date |
2023-05-11 |
|
|
