| Publication CODE |
Title |
| IEC 61189-2-804:2023 (2023-08) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-804: TEST METHODS FOR TIME TO DELAMINATION - T260, T288, T300 |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
21.00 €
|
16. |
Description
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2023-08-25 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2023-08-25 |
| IEC stability date |
2027-12-31 |
| IEC file modification date |
2023-08-25 |
| IEC last modification date |
2023-08-25 |
|
