| Publication CODE |
Title |
| IEC 63215-2:2023 (2023-10) |
ENDURANCE TEST METHODS FOR DIE ATTACH MATERIALS - PART 2: TEMPERATURE CYCLING TEST METHOD FOR DIE ATTACH MATERIALS APPLIED TO DISCRETE TYPE POWER ELECTRONIC DEVICES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
46. |
Description
IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices.
This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages.
NOTE'The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2023-10-24 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2023-10-24 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2023-10-24 |
| IEC last modification date |
2023-10-24 |
|
