| Publication CODE |
Title |
| IEC TR 61760-5-1:2024 (2024-01) |
SURFACE MOUNTING TECHNOLOGY - PART 5-1: SURFACE STRAIN ON CIRCUIT BOARDS - STRAIN GAUGE MEASUREMENT APPLIED TO CHIP COMPONENTS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
24. |
Description
IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called 'bending cracks'. Area-array components are excluded from the scope of this document.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2024-01-31 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2024-01-31 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2024-01-31 |
| IEC last modification date |
2024-01-31 |
|
