| Publication CODE |
Title |
| IEC 61189-2-720:2024 (2024-03) |
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-720: DETECTION OF DEFECTS in INTERCONNECTION STRUCTURES BY MEASUREMENT OF CAPACITANCE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
21. |
Description
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2024-03-06 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2024-03-06 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2024-03-06 |
| IEC last modification date |
2024-03-06 |
|
