| Publication CODE |
Title |
| IEC 61188-5-1:2002 (2002-07) |
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
366.00 €
|
141. |
Description
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2002-07-12 |
| ICS-Code (International Standards Classification) |
31.180
, 31.190
|
|
| IEC publication date |
2002-07-12 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2017-11-15 |
|
