| Publication CODE |
Title |
| IEC 61188-5-4:2007 (2007-10) |
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
15. |
Description
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2007-10-30 |
| ICS-Code (International Standards Classification) |
31.180
|
|
| IEC publication date |
2007-10-30 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2017-11-15 |
|
