| Publication CODE |
Title |
| IEC 61189-2:2006 (2006-05) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
366.00 €
|
122. |
Description
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2006-05-30 |
| ICS-Code (International Standards Classification) |
31.180
|
|
| IEC publication date |
2006-05-30 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2019-11-20 |
|
