| Publication CODE |
Title |
| IEC 61190-1-1:2002 (2002-03) |
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS in ELECTRONICS ASSEMBLY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
41. |
Description
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2002-03-25 |
| ICS-Code (International Standards Classification) |
31.190
|
|
| IEC publication date |
2002-03-25 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2019-11-20 |
|
