| Publication CODE |
Title |
| IEC 61192-3:2002 (2002-12) |
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
286.00 €
|
93. |
Description
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2002-12-17 |
| ICS-Code (International Standards Classification) |
31.190
|
|
| IEC publication date |
2002-12-17 |
| IEC stability date |
2018-11-30 |
| IEC last modification date |
2018-11-30 |
|
