| Publication CODE |
Title |
| IEC 61192-4:2002 (2002-11) |
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
59. |
Description
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2002-11-29 |
| ICS-Code (International Standards Classification) |
31.190
|
|
| IEC publication date |
2002-11-29 |
| IEC stability date |
2018-11-30 |
| IEC last modification date |
2018-11-30 |
|
