| Publication CODE |
Title |
| IEC 61249-8-8:1997 (1997-06) |
MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
19. |
Description
Provides requirements for the qualification of temporary solder resist coatings.
Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1997-06-24 |
| ICS-Code (International Standards Classification) |
31.180
|
|
| IEC publication date |
1997-06-24 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2018-11-02 |
|
