Publication details
| Publication CODE |
Title |
| IEC 62137:2004 (2004-07) |
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
57. |
Description
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.
This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Status
Origin
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
Approval
| BEC Approval |
2004-07-14 |
| ICS-Code (International Standards Classification) |
31.120
|
|
| IEC publication date |
2004-07-06 |
| IEC stability date |
2013-12-31 |
| IEC last modification date |
2014-10-09 |
|
|
