| Publication CODE |
Title |
| IEC PAS 61249-3-1:2007 (2007-05) |
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES
PART 3-1: COPPER-CLAD LAMINATES FOR FLEXIBLE BOARDS (ADHESIVE AND NON-ADHESIVE TYPES) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
249.00 €
|
31 P. |
Description
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2007-05-30 |
| ICS-Code (International Standards Classification) |
31.180
|
|
| IEC publication date |
2007-05-30 |
| IEC stability date |
2013-12-31 |
| IEC last modification date |
2015-01-09 |
|
