| Publication CODE |
Title |
| IEC PAS 62137-3:2008 (2008-11) |
ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
286.00 €
|
41. |
Description
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2008-11-13 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2008-11-13 |
| IEC last modification date |
2011-11-08 |
|
